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Difference advantage between dry plasma cleaning and wet cleaning

  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-01
  • Views:

(Summary description)CRF plasma cleaning is the use of working gas under the action of electromagnetic fields to excite the plasma and the surface of the object to produce physical and chemical reactions, so as to achieve the purpose of cleaning. Wet cleaning is the use of chemical solvent or water in a certain period of time to clean the object, in order to achieve the purpose of cleaning. Plasma cleaning is the use of different gases for object treatment cleaning, no waste, its gas can be directly discharged into the atmosphere through the vacuum system and neutralizer after treatment, health, environmental protection, benefit, safety. Compared with plasma cleaning, wet cleaning tends to produce a large amount of waste and chemical gas, which is not conducive to health and environmental safety. Recently, the customer mentioned that the use of plasma cleaning equipment caused sputtering damage on the material surface. In fact, as long as the energy control is appropriate, mild surface damage can enhance the adhesion of the workpiece itself. In some cases, plasma cleaning treatment becomes an indispensable process. For example, Ar plasma is used to remove surface oxides of some materials. Of course, some process tests have shown that this kind of damage can be minimized by using a step-by-step process for cleaning. In addition, we believe that wet cleaning will be more harmful to materials beyond control, and plasma cleaning treatment is more worthy of application. In addition, the toxicity of plasma cleaning residues has been studied deeply at home and abroad. With its advantages in health, environmental protection, benefit and safety, the plasma cleaning equipment and process gradually replace the wet cleaning process, especially in the precision parts cleaning and new semiconductor materials research and integrated circuit device manufacturing industry, the plasma cleaning application prospect is broad.

Difference advantage between dry plasma cleaning and wet cleaning

(Summary description)CRF plasma cleaning is the use of working gas under the action of electromagnetic fields to excite the plasma and the surface of the object to produce physical and chemical reactions, so as to achieve the purpose of cleaning. Wet cleaning is the use of chemical solvent or water in a certain period of time to clean the object, in order to achieve the purpose of cleaning. Plasma cleaning is the use of different gases for object treatment cleaning, no waste, its gas can be directly discharged into the atmosphere through the vacuum system and neutralizer after treatment, health, environmental protection, benefit, safety. Compared with plasma cleaning, wet cleaning tends to produce a large amount of waste and chemical gas, which is not conducive to health and environmental safety.

Recently, the customer mentioned that the use of plasma cleaning equipment caused sputtering damage on the material surface. In fact, as long as the energy control is appropriate, mild surface damage can enhance the adhesion of the workpiece itself. In some cases, plasma cleaning treatment becomes an indispensable process. For example, Ar plasma is used to remove surface oxides of some materials. Of course, some process tests have shown that this kind of damage can be minimized by using a step-by-step process for cleaning. In addition, we believe that wet cleaning will be more harmful to materials beyond control, and plasma cleaning treatment is more worthy of application.

In addition, the toxicity of plasma cleaning residues has been studied deeply at home and abroad. With its advantages in health, environmental protection, benefit and safety, the plasma cleaning equipment and process gradually replace the wet cleaning process, especially in the precision parts cleaning and new semiconductor materials research and integrated circuit device manufacturing industry, the plasma cleaning application prospect is broad.


  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-01 09:14
  • Views:
Information

The difference and advantage between dry plasma cleaning and wet hair cleaning:

CRF plasma cleaning is the use of working gas under the action of electromagnetic fields to excite the plasma and the surface of the object to produce physical and chemical reactions, so as to achieve the purpose of cleaning. Wet cleaning is the use of chemical solvent or water in a certain period of time to clean the object, in order to achieve the purpose of cleaning. Plasma cleaning is the use of different gases for object treatment cleaning, no waste, its gas can be directly discharged into the atmosphere through the vacuum system and neutralizer after treatment, health, environmental protection, benefit, safety. Compared with plasma cleaning, wet cleaning tends to produce a large amount of waste and chemical gas, which is not conducive to health and environmental safety.

Recently, the customer mentioned that the use of plasma cleaning equipment caused sputtering damage on the material surface. In fact, as long as the energy control is appropriate, mild surface damage can enhance the adhesion of the workpiece itself. In some cases, plasma cleaning treatment becomes an indispensable process. For example, Ar plasma is used to remove surface oxides of some materials. Of course, some process tests have shown that this kind of damage can be minimized by using a step-by-step process for cleaning. In addition, we believe that wet cleaning will be more harmful to materials beyond control, and plasma cleaning treatment is more worthy of application.

In addition, the toxicity of plasma cleaning residues has been studied deeply at home and abroad. With its advantages in health, environmental protection, benefit and safety, the plasma cleaning equipment and process gradually replace the wet cleaning process, especially in the precision parts cleaning and new semiconductor materials research and integrated circuit device manufacturing industry, the plasma cleaning application prospect is broad.

The difference and advantage between dry plasma cleaning and wet hair cleaning

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