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The application of plasma generator in the treatment of adhesion and proliferation of PEGDA-based gel surface
The application of plasma generator in the treatment of adhesion and proliferation of PEGDA-based gel surface: The adhesion of target cells to biological materials is a prerequisite for the construction of tissue-engineered organs. Materials with good cell compatibility provide a good extracellular growth environment for cells, and maintain the normal phenotype and physiological functions of cells, and realize the restoration of tissue or organ structure and function. Polyethylene glycol (PEG) is a non-degradable polymer biomaterial approved by the US FDA. It has hydrophilicity, biocompatibility, and inhibits protein adsorption and cell adhesion. Low-molecular-weight PEG can be swallowed by phagocytes or excreted through the kidney membrane. Although the surface of the PEG-loaded material has good biocompatibility, it is difficult for cells to adhere to the surface of the material due to its resistance to proteins and cells. And growth. Therefore, the PEG substrate is activated and modified by introducing active groups, so that it can be used to construct desired biological functional materials. The chemical functional groups on the surface of biological materials (such as hydroxyl, amine, carboxyl, carbonyl, amide, etc.) have an important impact on cell compatibility and affect the hydrophilicity and hydrophobicity of the material. The hydroxy Z methacrylate monomer with active hydroxyl groups was introduced into the polyethylene glycol diacrylate substrate. The research results show that the hydroxyl groups are beneficial to cell adhesion and spreading, thereby improving the cells of PEGDA-based gel materials. Affinity; On the other hand, the surface energy of the material has an important effect on cell compatibility. It is generally believed that higher surface energy is beneficial to cell adhesion, spreading and proliferation. The use of plasma generator glow discharge surface modification technology can improve some Polar oxygen-containing and nitrogen-containing groups (such as amino and amide groups) are introduced into the surface of chemically inert materials to improve their biocompatibility. The surface roughness of the material after plasma treatment by the plasma generator is increased, and the increased surface can enhance the cell affinity of the material. After the material is plasma treated, due to the action of free radicals, electrons and ions in the plasma, the chemical bonds on the surface of the material are broken to form new chemical bonds, and the distribution of electrons near the elements also changes. The interaction between cells and matrix materials is the main field of tissue engineering research. Among them, the adhesion of cells and materials is the basis. Cells must properly adhere to the materials in order to migrate, proliferate and differentiate. The surface roughness and hydrophobicity of the materials are related to The surface energy of materials is closely related, which affects cell adhesion and proliferation. After the plasma surface treatment by the plasma generator, the surface of the membrane material is rougher than that before treatment, with uneven, undulating height, which can increase the surface area of ​​the contact between the cells and the material, and at the same time facilitate the extension of the filopodia at the cell protrusions. The filopodia are beneficial to the adhesion and spreading of cells on the surface of the material. After the material is treated with plasma, the hydrophilicity and surface energy of the material are greatly enhanced, which promotes the wetting effect of the cells on the surface of the material, and the rough surface improves the adhesion of the cells. The material modified by the plasma generator ion surface showed better cell proliferation than the unmodified membrane surface, and the cell adhesion rate was increased. The proliferation of the material after plasma treatment was generally more active than that before the treatment, and the plasma treatment condensed The film material is more conducive to the proliferation and growth of BMS on the material. Plasma-treated materials have stronger cell adaptability than untreated materials, have a higher adhesion rate, vigorous proliferation in vitro, stable growth characteristics, and form a network structure.
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Application of low-temperature plasma surface treatment equipment in cardiovascular stents and intraocular lenses
Application of low-temperature plasma surface treatment equipment in cardiovascular stents and intraocular lenses: The urinary catheters and infusion sets in interventional instruments with low-temperature plasma surface treatment equipment have been introduced before. The biocompatibility and material bonding performance have been greatly improved, which can effectively reduce the actual clinical application of interventional instruments. The accident rate in the application. Therefore, what is the use of low-temperature plasma surface treatment equipment technology in implantable medical devices? This article mainly introduces two typical cardiovascular stents and intraocular lens devices. The processing technology of the low-temperature plasma surface treatment equipment improves the uniformity and durability of the cardiovascular stent drug coating: Almost all implantable biomaterials and related devices can be directly used in the human body, so they must have biocompatibility, such as cardiovascular stents and other materials that directly contact the blood must also have blood compatibility, so they will be used in the cardiovascular system. The surface of the stent is coated with a drug coating. The use of low-temperature plasma surface treatment technology can improve the bonding ability between the stent and the film. The main method is to use low-temperature plasma surface treatment technology to perform plasma treatment on the stent, which can improve the wettability of the stent surface and increase the adhesion. Make the medicinal film more uniform and firm. The treatment technology of the low-temperature plasma surface treatment equipment improves the hydrophilicity of the intraocular lens and effectively solves the postoperative inflammation problem: PAM intraocular lens is a new type of soft material with good diopter and flexibility, and its surface is highly viscous, can produce strong adhesion to the posterior capsule, and can effectively promote the migration and proliferation of lens epithelial cells. Reduce the occurrence of posterior capsule turbidity. However, the PAM material is highly hydrophobic and easily adsorbs bacteria and cells, resulting in postoperative inflammation. In order to improve the reliability of the intraocular lens and prevent inflammation, all current low-temperature plasma surface treatment equipment adopts the low-temperature plasma surface treatment process, and the corresponding process modification is used to increase its surface energy and improve its infiltration performance. Chengfeng Zhizao uses low-temperature plasma surface treatment technology to actively cooperate with customers to carry out research on the surface modification of medical polymer materials and surface film synthesis to solve the problem of anticoagulant, biocompatibility, surface hydrophilicity, anti-calcification and Key technical issues such as cell growth and inhibition. If you want to know more about the low-temperature plasma surface treatment equipment, or have questions about the use of the equipment, please click Chengfeng Zhizao online customer service, Chengfeng Zhizao is waiting for your call!
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The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it
The technology of vacuum plasma machine is eye-opening, and contact lenses can also be processed with it: With the rapid development of low-temperature plasma surface treatment technology, vacuum plasma machines have been widely used in many industries such as automobile manufacturing, textiles, medical equipment, health and beauty, cosmetics, etc., and gradually penetrated into people’s lives, quietly changing people’s lives . Maybe you still have some doubts, contact lenses can also be processed in a vacuum plasma machine. Contact lenses, also called contact lenses, are lenses worn on the cornea of ​​the eyeball to correct vision or protect the eyes. Contact lenses can be divided into hard, semi-hard, and soft according to their softness and hardness. Because of its small size, light weight, easy-to-wear, beautiful appearance, it has been favored by consumers in recent years. Now if I ask you, what are the characteristics of contact lenses? How to choose? Is it impossible to answer for a while? In fact, wearing contact lenses is comfortable and not dry, and the surface is aseptic and hygienic. These characteristics actually contain many characteristics that contact lenses need to have, such as smooth surface, good water wettability, and good durability. , Wearing comfort, reducing bacterial adhesion, etc. These characteristics sometimes require the low-temperature plasma processing technology of the vacuum plasma machine to complete. At present, the main method of caring for hard lenses is washing and dipping with care solution, which is of great help to the safe use of lenses. However, the above methods still cannot fundamentally solve the problems of the deterioration of the physical properties of the lens and the decrease in comfort with the increase of use time, and some impurities on the surface of the lens cannot be completely removed by the care solution. In order to ensure the user's better wearing safety and comfort, it is very important to perform surface treatment on the contact lens through a vacuum plasma machine. After the surface of the contact lens is treated by the vacuum plasma machine, the surface can be further cleaned to make the surface of the lens smooth, water-wet, durable, comfortable to wear, and reduce bacterial adhesion. Chengfeng Zhizhuang has focused on the research and development of vacuum plasma machines for 20 years. If you want to know more product details or have questions about the use of the equipment, please click Chengfeng Zhizhao's online customer service, waiting for your call!
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Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharg
Chengfeng Zhizhi plasma etching machine introduces the characteristics of dielectric barrier gas discharge: For the various working gases of the plasma etching machine, the inert gas is uniformly distributed in the discharge dielectric barrier at atmospheric pressure, and the metal circular electrode with the parallel plate structure can be used to study the discharge characteristics and properties of the inert gas in the dielectric barrier. The diameter of the electrode used in this study is 50mm, and the two electrodes are respectively coated with a layer of 1mm thick quartz glass, with a relative permittivity of 3.9 and an air gap interval of 5mm. The electrode and the barrier medium are placed in the discharge chamber, and the discharge chamber is first evacuated to below 5 Pa, and then filled with high-purity helium, argon and other gases. Use the ICCD high-speed camera to capture the side image of the DBD discharge, use the ITO transparent electrode as the bottom electrode and the 45° plane lens to assist, you can shoot to the bottom of the discharge area. The measured applied voltage Va, the total discharge current Vi and the calculated air gap voltage Vg waveform, wherein the measured quasi-sinusoidal dashed line is the applied voltage waveform, and the thin solid line is the current waveform. There is a current pulse on the applied voltage in every half cycle, which is a typical feature of uniform dielectric barrier discharge under the atmospheric pressure of a plasma etching machine. When studying the discharge mechanism, people are more concerned about the Vg value of the air gap voltage, but due to the existence of the barrier medium, the air gap voltage cannot be measured directly. Using the measured voltage Va and discharge current i, combined with the equivalent circuit of the plasma etching machine DBD, the voltage g can be calculated. Based on the measured voltage Va and the total discharge current i, the real voltage Vg on the air gap and the current id flowing in the flowing air gap are calculated. In this process, Vm(to) characterizes the cumulative effect of the discharge on the surface of the dielectric before to. When using the Vm(to) method to calculate, make the average value of Vm(t) 0 within an applied voltage cycle, that is, there is no self-polarization in the medium. The displacement current in helium discharge is much smaller than the transport current, so the transport current is basically the same as the actual measured total current, and it is no longer calculated separately. In the air gap, the voltage Vg increases with the increase of the applied voltage Va, and then decreases rapidly with the air gap discharge. This inflection point corresponds to the breakdown voltage of the air gap. When confirming the spatial uniformity of the discharge of the plasma etching machine, a 10ns discharge image can be taken near the peak of the discharge current, and it is found that the discharge has no light and dark discharge filaments, indicating that the discharge is uniform in space, so this is The discharge that is relatively easy to obtain in atmospheric pressure helium gas is uniform discharge; at the same time, it can be seen that there is a high-brightness light-emitting layer near the instantaneous cathode, which is a typical feature of glow discharge. Therefore, it can be concluded that the atmospheric pressure helium discharge belongs to the glow discharge. Light discharge. It can be seen from the voltage, current waveform and side light emission of the plasma etching machine that the power frequency is about 33kHz, the air gap thickness is about 6mm, the positive electrode is on the top, and the negative electrode is on the bottom. In addition, comparing the voltage and current waveform diagrams and the side emission diagrams, it can be seen that helium and helium DBD are very similar. The difference between the two is that their positive column area is not obvious, while the Faraday dark area is almost non-existent. The breakdown strength of the gas gap voltage waveform can be calculated. The breakdown strength of 6mm gas is 1kV/cm, which is much lower than that of atmospheric pressure gas of 30kV/cm. This low breakdown field strength is the guarantee for achieving uniform discharge of helium and gas at atmospheric pressure of the plasma etching machine. Chengfeng Zhizao has focused on plasma etching machine technology for 20 years. If you have any questions, please click on the Chengfeng Zhizao online customer service for consultation. Chengfeng Zhizao is waiting for your call!
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In 2021, the low-temperature plasma cleaning machine manufactured by Chengfeng Intelligent will enter the biomedical field again
In 2021, the low-temperature plasma cleaning machine manufactured by Chengfeng Intelligent will enter the biomedical field again: The cost advantage is the huge advantage of domestic medical biomaterials and related devices. With the continuous improvement and implementation of the hierarchical diagnosis and treatment policy, primary medical and health institutions have an increasing demand for yi treatment machines. At the same time, the hospital’s more refined budget management has also encouraged relevant institutions to prefer to purchase domestically-made equipment that is more cost-effective. Under this background, the domestic medical materials and equipment market has a good development prospect. , Looking forward to the low temperature plasma cleaning equipment made by Chengfeng Zhizhi once again set sail in the field of medical biology, and take advantage of the trend. As a high-duan precision manufacturing industry, the core competitiveness of the medical device industry is still technology. Due to the particularity of yi therapy equipment, the safety and effectiveness control requirements are usually very strict. Its technology involves many industries such as medicine, machinery, electronics, plastics, etc. The plasma treatment process of the low temperature plasma cleaning machine also has its unique treatment Requirements, especially medical polymer materials, in addition to certain functional properties and mechanical properties, must also meet the basic requirements of biocompatibility. The company has many years of experience in low-temperature plasma cleaning machine processing services, providing customers with plasma surface treatment services, and using low-temperature plasma cleaning machine processing technology, with the surface modification of medical polymer materials and surface film synthesis research, to solve the problem of anticoagulation, Key technologies such as biocompatibility, hydrophilic polymer surface, anti-calcification, cell growth and cell compatibility. The equipment has been widely used in materials such as cardiovascular stents, intraocular lenses, three-dimensional cell culture stents, urinary catheters, syringes, cardiac leak traps, puncture heads, diagnostic test strips, microfluidic biochips, petri dishes, 96-well microtiter plates, etc. Surface treatment. By 2021, Chengfeng Zhizhi plasma cleaning machine is expected to be more closely integrated with medical materials and equipment related fields, and take advantage of the trend. Chengfeng Zhizao has focused on plasma cleaning machines for 20 years. If you have any questions, please click on the Chengfeng Zhizao online customer service for consultation. Chengfeng Zhizao is waiting for your call!
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Application of plasma etching technology in chip integrated circuit manufacturin
Application of plasma etching technology in chip integrated circuit manufacturing: Plasma etching is one of the key processes in the manufacture of chip integrated circuits. Its purpose is to completely copy the mask pattern to the surface of the silicon wafer. Its scope covers the control of the size of the front-end CMOS gate, as well as the etching and etching of the back-end metal aluminum. Etching of Via and Trench. Today, no integrated circuit chip can be completed without plasma etching technology. The investment in etching equipment accounts for about 10% to 12% of the equipment investment in the entire chip factory, and its technological level will directly affect the quality of the product and the advancement of production technology. It was reported very early that the literature on plasma etching technology was published in Japan in 1973, and soon attracted the attention of the industry. The parallel electrode etching reaction chamber (Reactive Ion Etch-RIE), which is still widely used in chip integrated circuit manufacturing, was proposed in 1974. This kind of reaction chamber consists of the following items: a vacuum chamber and a vacuum system, a gas system for providing different gas types and flow rates, a radio frequency power supply and its regulating and matching circuit system. The principle of plasma etching can be summarized as the following steps: 1. Under low pressure, the reaction gas is excited by radio frequency power to produce ionization and form plasma. The plasma is composed of charged electrons and ions. The gas in the reaction chamber is converted into ions under the impact of electrons. , Can also absorb energy and form a large number of active groups; 2. The active reactive group and the surface of the etched substance form a chemical reaction and form a volatile reaction product; 3. The reaction product separates from the surface of the etched material and is drawn out of the cavity by the vacuum system. In a plasma reaction chamber with parallel electrodes, the etched object is placed on an electrode with a smaller area. In this case, a DC bias voltage will be formed between the plasma and the electrode and cause a positively charged reaction. The gas ions accelerate to hit the surface of the etched material. This ion bombardment can greatly accelerate the chemical reaction on the surface and the desorption of reaction products, resulting in a high etching rate. It is precisely because of the existence of ion bombardment that all directions The opposite sex is etched. There are many types of plasma etching technology, such as pure physical etching, pure chemical reactive etching, and so on. Etching can be divided into wet etching and dry etching. The etching method used in the early chip semiconductor manufacturing process is wet etching, that is, using a specific chemical solution to decompose the part of the film to be etched that is not covered by photoresist, and convert it into a compound that is soluble in the solution, and then eliminate it to achieve etching. the goal of. Plasma is a state of existence of matter. Generally, matter exists in three states: solid, liquid, and gas, but in some special cases, there is a fourth state, such as the ionosphere in the earth’s atmosphere. The following substances exist in the plasma state: electrons in a state of high-speed motion; neutral atoms, molecules, and groups of atoms (radicals) in an activated state; ionized atoms and molecules; unreacted molecules, atoms, etc., but the substance is in the whole The electrical neutral state is still maintained. In the vacuum chamber, a high-energy disordered plasma is generated by the radio frequency power supply under a certain pressure, and the surface of the product is cleaned by plasma bombardment. In order to achieve the purpose of cleaning.
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