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Plasma cleaning equipment low-temperature plasma treatment of the surface performance of the fluorine-containing coating on the solar backplane
Plasma cleaning equipment low-temperature plasma treatment of the surface performance of the fluorine-containing coating on the solar backplane: Photovoltaic power generation is a hot topic at the moment, especially the concept of distributed photovoltaics, which further makes photovoltaic power generation a clean energy that residents can afford. The use environment of solar panels is harsh, so the performance of solar backplanes is very important. As the protective layer of solar cells, the solar back sheet must have excellent weather resistance, high insulation, low water permeability and good adhesion performance. There are currently two main types of solar backplanes: 1: Coated back sheet, using fluorine-containing resin coated on the surface of the substrate PET polyester film; 2: Glue-coated composite back sheet, using a layer of fluorine film on the surface of the base material polyethylene terephthalate (PET) film.  In actual use, it can be freely combined according to the use environment, performance requirements, price and other factors. Fluorine-containing material has good weather resistance, but it also has high water and oil repellency, which is not conducive to bonding with solar encapsulation film EVA. Plasma cleaning equipment low-temperature plasma treatment of the surface of fluorine-containing materials, improve the bonding performance of fluorine-containing materials and solar packaging film ethylene-vinyl acetate copolymer (EVA), and provide stable and effective protection for solar cells. The electrons in the low-temperature plasma of the plasma cleaning equipment obtain energy from the electric field and become free high-energy electrons. They collide with atoms and molecules in the gas to produce excitation and ionization phenomena, and the excited molecules, atoms, ions and free radicals generated thereby are all The extremely unstable ones have high chemical reactivity and are prone to some reactions to generate new compounds. When the fluorocarbon coatings are processed, the surface layer can be etched to form new properties, or cause cross-linking and polymerization. Under the same processing speed, the processing power of the plasma cleaning equipment plasma processor increases, the contact angle decreases, and the surface tension increases. After reaching a certain power, the surface tension and contact angle tend to be stable. The peeling force between the backsheet and EVA is also consistent with the changes exhibited by the changes in surface tension, and tends to be stable. After low-temperature plasma treatment, the surface energy of the fluorine-containing coating increases, the contact angle decreases, and the peeling force of EVA increases, thereby improving its adhesion to EVA. With the increase of plasma cleaning equipment's low-temperature plasma processing power and time, it is conducive to the improvement of its surface performance.
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The role of plasma cleaning machine equipment plasma surface treatment of tiny holes
The role of plasma cleaning machine equipment plasma surface treatment of tiny holes: Plasma cleaning equipment is mainly suitable for surface modification treatment of various materials: surface cleaning, surface activation, surface etching, surface deposition, surface treatment and plasma-assisted chemical vapor deposition. With the miniaturization of the diameter of HDI plates, traditional chemical cleaning processes can no longer meet the requirements of cleaning blind hole structures. The surface tension of the liquid makes it difficult for the liquid to penetrate into the holes, especially when processing laser-drilled micro blind holes. not good. At present, the hole cleaning process applied to micro-buried blind holes mainly includes ultrasonic cleaning and plasma cleaning of plasma cleaning machine equipment. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on The decontamination performance of the cleaning liquid increases the problem of waste liquid treatment. The commonly used process at this stage is mainly the plasma cleaning process. The plasma treatment process is simple and environmentally friendly, the cleaning effect is obvious, and it is very effective for the blind hole structure. Plasma cleaner equipment cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and the gas curing reaction occurs with the drilling dirt on the hole wall, and the generated gas products and some unreacted particles are discharged by the air pump. Plasma is generally divided into three steps when cleaning the blind holes of HDI boards. In the first stage, high-purity N2 is used to generate plasma, while the printed board is preheated to make the polymer material in a certain activated state; the second stage is with O2, CF4 is the original gas, which produces O and F plasma after mixing, which reacts with acrylic acid, PI, FR4, glass fiber, etc. to achieve the purpose of de-drilling; the third stage uses O2 as the original gas, and the generated plasma and reaction residues Make the hole wall clean. In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction. With the development of materials and technology, the realization of the buried blind hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical desmear method , And the cleaning method of plasma treatment of plasma cleaning machine equipment can well overcome the shortcomings of wet desmear, and can achieve a better cleaning effect on blind holes and micro holes, so as to ensure that the blind holes are electroplated and filled. good effect.
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What is the process of the oxygen plasma surface treatment instrument to treat silicon dioxide film materials
What is the process of the oxygen plasma surface treatment instrument to treat silicon dioxide film materials: The oxygen plasma surface treatment instrument plasma process is used to assist in the treatment of materials, in which the chemical reaction between the gas phase and the solid phase surface plays a key role. When etching silicon dioxide films, the oxygen plasma surface treatment instrument can also work, the working process of a typical reactor in plasma surface treatment equipment. The input gas is a mixture of carbon tetrafluoride and oxygen, and the plasma is excited by radio frequency or electric field. Various ions such as CF3+, CF2+, O2+, O- and F- are generated during the electron impact ionization process; free radicals such as CF3, CF2, O, and F are generated during the electron impact decomposition process. The oxygen plasma surface treatment instrument can generate CO, CO2, SiF2, SiF4 and other molecules through the chemical reaction between the gas phase and the silicon dioxide surface. The concentration and energy distribution of the particles have a greater impact on the etching rate, anisotropy index and selectivity of the plasma cleaner. The particle concentration of these oxygen plasma surface treatment instruments is determined by some common physical and chemical processes. This includes the generation of electron-ion pairs; the generation of free radicals; the generation of negative ions; gas phase chemical reactions; the migration of ions on the surface; the migration of free radicals on the surface; and the surface phase reactions. This is a complete reaction process of the oxygen plasma surface treatment instrument, and the formula is as follows. E+AB →AB+ +2e E+AB →e+A+B E+AB→A- +B E+A+B→C+D Fi=-Da▽ni FA=-Da▽nA A(g)+B(s) →C(g)
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Why plasma surface activation treatment equipment is used in LED packaging process, do you really know
Why plasma surface activation treatment equipment is used in LED packaging process, do you really know: After rapid economic development, my country's LED industry has maintained a considerable growth rate whether it is upstream chips, midstream packaging, or downstream applications. In recent years, due to the promotion of industry technology, the performance of LED products has improved significantly, and the industrial market prospect is very broad. Moreover, driven by the development of science and technology, it is indispensable to increase the demand for cleaning and activation, so plasma surface activation treatment equipment is used for cleaning, then what is the relationship between plasma surface activation treatment equipment and LED packaging process? The necessity of introducing plasma surface activation treatment equipment into the LED packaging process: When it comes to the relationship between plasma surface activation treatment equipment and LED packaging technology, one has to say that the difficulty often encountered in LED packaging technology is the need for process improvement. In the LED packaging process, if organic pollutants, oxide layers and other contaminants exist on the surface of the substrate, bracket and other devices, it will affect the yield of the entire packaging process, and even cause irreversible damage to the product in severe cases. In order to ensure the entire process and the quality of the product, plasma cleaning equipment is generally introduced for plasma surface treatment before the three processes of silver glue, wire bonding, and LED sealing, so as to completely solve the above problems. Principles and specific functions of plasma treatment equipment: The plasma activation equipment completes the removal of contaminants and oxide layers on the surface of the LED device through the chemical or physical interaction between the plasma formed after ionization and the surface of the material, thereby improving the surface activity of the device. The process is safe, stable and not Will cause damage to the device. The use of plasma surface activation treatment equipment in the LED packaging process mainly includes the following three aspects: before dispensing silver glue, before wire bonding, and before LED sealing glue, I will give you a detailed introduction in other articles.
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The influence of plasma treatment on the surface hydrophilicity of graphite film
The influence of plasma treatment on the surface hydrophilicity of graphite film: Graphite film is a new type of heat dissipation material that has emerged in recent years, and its horizontal direction has an ultra-high thermal conductivity. However, because the graphite film has a layered crystal structure, there is van der Waals force between the layers, which makes the vertical thermal conductivity of the graphite film poor, and even has a certain heat insulation effect, which seriously affects the heat dissipation performance of the graphite film. Graphite film/metal matrix composite materials, by using the excellent thermal conductivity of metal materials, effectively make up for the shortcomings of the graphite film’s poor thermal conductivity in the vertical direction. At present, the main preparation method is to magnetron sputter copper and other metal films on the surface of the graphite film. Or use a rewinder to composite the graphite film, thermal conductive glue and metal materials into a composite shape. The use of magnetron sputtering to prepare graphite film/metal matrix composites is expensive and energy-consuming, making it difficult to achieve large-scale material preparation and continuous production. The graphite film/metal composite heat sink is prepared by a rewinder. Because the metal plate used in this method is thick and the thermal performance of the middle thermal conductive adhesive layer is poor, the heat dissipation performance is seriously affected. Due to the smooth surface and strong hydrophobicity of the graphite film, the interface performance between the graphite film and the metal film is poor, and the bonding force between the graphite film and the metal film is very weak. Therefore, how to improve the hydrophilicity of the graphite film is a key issue to enhance the bonding force between the graphite film and the metal coating. After the graphite film is plasma treated, the surface is etched and oxygen-containing polar groups are introduced. The plasma treatment significantly improves the hydrophilicity of the graphite film surface. Plasma modification only occurs on the surface of the material. It can fully improve the surface properties of the material without changing the inherent properties of the material. It is a simple, clean, efficient, energy-saving and environmentally-friendly surface modification method. The surface of the graphite film before and after plasma treatment contains C and O elements, but according to the molecular structure of the graphite film, it is impossible for the untreated graphite film to contain oxygen. However, the full scan reveals that the graphite film contains trace amounts of oxygen. The graphite film is in the atmosphere before XPS, and impurities or water vapor in the air are adsorbed on the surface of the graphite film, thereby introducing oxygen. After plasma treatment, oxygen-containing functional groups such as hydroxyl and carboxyl groups were introduced, resulting in a significant change in the chemical composition of the graphite film surface. The C atom number fraction decreased from 98.37% before the treatment to 83.13%, and the O atom number fraction was changed from that before the treatment. 1.63% increased to 16.87%, and the O/C content ratio increased from 1.66% before treatment to 20.29%. The introduction of these oxygen-containing groups is one of the reasons for the increased hydrophilicity of the graphite film surface. The peel strength of copper-plated samples decreases with the increase of the contact angle of water droplets on the surface of the graphite film, which can qualitatively indicate that the hydrophilicity of the graphite film surface is better after plasma treatment, and the copper plating layer electrodeposited on the graphite film is more The stronger the bonding force of the substrate. On the graphite film without plasma treatment, the bonding force of the electrodeposited copper coating is very weak. There are two mechanisms by which plasma treatment can improve the bonding force between copper and graphite film. First, plasma treatment of the graphite film will cause a large number of carboxyl and hydroxyl groups on the surface. These oxygen-containing functional groups significantly enhance the hydrophilicity of the graphite film surface. When copper is electrodeposited on the surface of the graphite film, the copper reacts with the oxygen in the carboxyl group or the hydroxyl group to form a Cu-O bond, which can enhance the bonding force between the copper and the substrate. Second, the plasma treatment makes the surface of the graphite film rough, and the surface roughness of the material has a good effect on improving the adhesion of the coating. The bonding force between the graphite film and the copper plating layer can be qualitatively characterized by the hydrophilicity of the graphite film surface. The better the hydrophilicity of the graphite film surface, the stronger the bonding
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Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging
Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging: Chengfeng Zhizhi plasma cleaning machine manufacturer equipment is widely used in metal, microelectronics, polymers, biological functional materials, low-temperature sterilization and pollution control and other fields. It is an ideal equipment for plasma surface treatment of enterprises and scientific research institutes. In the production process of microelectronic packaging, due to various fingerprints, fluxes, cross-contamination, natural oxidation, devices and materials will form various surface pollution, including organic matter, epoxy resin, photoresist and solder, metal salt, etc. These stains will have a significant impact on the packaging production process and quality. The use of encapsulated plasma cleaning machine can be easily removed through the formation of contamination in the molecular-level production process, ensuring that atoms and atoms are in close contact with the surface of the workpiece, thereby effectively improving the bonding strength, improving the quality of wafer bonding, and reducing leakage Rate, improve packaging performance, output and component reliability. The choice of plasma cleaning process in microelectronic packaging depends on the requirements of subsequent processes on the surface of the material, the original characteristic chemical composition of the surface of the material and the nature of the primer. Commonly used in plasma cleaning gas argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. The choice of plasma cleaning technology application. Small silver glue village bottom: Pollutants will cause the colloidal silver to be spherical, which is not conducive to chip sticking, and it is easy to stab the chip. The use of radio frequency plasma cleaning can greatly improve the surface roughness and hydrophilicity, which is beneficial to silver glue and tile sticking. Chips, while using the amount can save silver glue and reduce costs. Bow-wire bonding: Before the chip is bonded to the substrate and after high-temperature curing, the existing contaminants may contain microparticles and oxides. The physical and chemical reactions of these contaminants are lead and the bonding between the chip and the substrate is incomplete and the bonding strength is poor. , Adhesion is not enough. Before wire bonding, radio frequency plasma cleaning can significantly increase the surface activity and increase the bonding strength and tensile strength of the bonding wire. The pressure on the welding head can be low (when there are contaminants. The welding head penetrates the contaminants, more pressure is required), and in some cases, the bonding temperature can also be lowered, thereby increasing production and reducing costs. Gluing: In the epoxy resin process, pollutants will cause high foaming rate, resulting in low product quality and service life, so in order to avoid problems in the formation of the sealing foam. After cleaning the high daughter body such as radio frequency, the bonding of the chip and the substrate with the colloid will be closer. The foam formed will be greatly reduced, and the heat dissipation and light emissivity will be significantly improved.
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